LY5130-PF doc. no : qw0905- rev. : date : data sheet ligitek electronics co.,ltd. property of ligitek only rectangle type led lamps LY5130-PF 07 - apr.- 2008 a lead-free parts pb
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions ligitek electronics co.,ltd. property of ligitek only part no.LY5130-PFpage1/5 25.0min 2.54typ + - 1.0min 0.5 typ 1.5 max 7.0 0.7 2.8 2.0 5.0
ligitek electronics co.,ltd. property of ligitek only 585 wave length nm note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) operating temperature t opr LY5130-PF gaasp/gap yellow emitted yellow diffused lens part no material color storage temperature tstg forward current i f power dissipation peak forward current duty 1/10@10khz reverse current @5v ir pd i fp parameter symbol -40 ~ +85 viewing angle 2 1/2 (deg) max. 351.72.6 min. 3.04.588 typ. min. forward voltage @20ma(v) spectral halfwidth nm luminous intensity @ ma(mcd) -40 ~ +100 20 ma 10 a 60 80 mw ma ratings y unit p peak 10 part no. LY5130-PF2/5 page
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip part no. page3/5 LY5130-PF
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 50 0 0 preheat 25 2 /sec max 120 100 time(sec) 150 temp( c) 260 5 /sec max 260 c3sec max page 4/5 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only part no. LY5130-PF
mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solder resistance test thermal shock test high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. mil-std-202:103b jis c 7021: b-11 page 5/5 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test operating life test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-883:1008 jis c 7021: b-10 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. jis c 7021: b-12 test condition reliability test: test item description reference standard ligitek electronics co.,ltd. property of ligitek only part no. LY5130-PF
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